Flip Chip Dummy Component
4.8 (100) In stock
The dummy Flip package carrier, either substrates or lead frame provides the connection from the die to the exterior of the package.
Flip Chip Component - Daisy Chain Bumped Test Die TopLine FC, FA10
a) Layout of the dummy chip mimicking the size of the sensor chip
Die-level thinning of the multi-project-wafers.
Flip Chip Component - Daisy Chain Bumped Test Die TopLine FC, FA10
Flip Chip Component - Daisy Chain Bumped Test Die TopLine FC, FA10
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A process flow of compression molding for dummy chip-on-wafer
Wafer Chip Size Package (WLP) Dummy Component
a) Layout of the dummy chip mimicking the size of the sensor chip
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