Generic hybrid FPA with indium bump bonds [7].
5 (290) In stock
A monolithically integrated plasmonic infrared quantum dot camera
Fabrication of indium bumps for hybrid infrared focal plane array
Small pixel hybrid CMOS x-ray detectors (Erratum)
MRED simulations comparing reaction mechanisms with experimental
Die-to-Wafer Bonding - SET
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A monolithically integrated plasmonic infrared quantum dot camera
Colloidal quantum dot based infrared detectors: extending to the
a) Simulated absorption efficiency of the detector versus incident
Remote Sensing, Free Full-Text
Signal Readout for Transition-Edge Sensor X-ray Imaging
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Bump connections and wire bonds of 3D CMOL FPGA can serve as
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