Scaling Bump Pitches In Advanced Packaging

Higher density of interconnects will enable faster movement of data, but there's more than one way to achieve that.

A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials - ScienceDirect

A Broad Look Inside Advanced Packaging

Micromachines, Free Full-Text

Expanding Advanced Packaging Production In The U.S.

Kingston GB DDR4 2133 MHz SODIMM V CL15 260-Pin Notebook, 50% OFF

Heterogeneous Integration and IC Packaging - EE Times Europe

Kingston GB DDR4 2133 MHz SODIMM V CL15 260-Pin Notebook, 50% OFF

Why Advanced Packaging Materials Matter？(Part B)

Marco Mezger on LinkedIn: #interconnects #ic #data #data #technologies #copper…

Marco Mezger on LinkedIn: #interconnects #ic #data #data #technologies #copper…

High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express

Marco Mezger on LinkedIn: #interconnects #ic #data #data #technologies #copper…

Inside the iPad 2: Chip brings 50% browsing boost - CNET

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Apple iPad 10, 10.9 in. 256 GB, Wi-Fi, A14 Bionic Chip with Neural Engine

What Is a Phase-Change Thermal Pad and How Does It Work?

Wafer Level Chip Size Package (WLCSP) Guidelines - EEWeb