UBM (under bump metallurgy) structure

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Effect of Under Bump Metallization (UBM) Quality on Long Term Reliability

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect

US20120091576A1 - Under-bump metallization (ubm) structure and method of forming the same - Google Patents

UBM (Under Bump Metallization)

Pb-Free Solders for Flip-Chip Interconnections

Figure 1 from Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization

Scaling Bump Pitches In Advanced Packaging

Test Structures for (a) Direct Bump with metal interconnect only and