Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

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4.6 (491) In stock

Huiqin LING, Shanghai Jiao Tong University, Shanghai, SJTU, State Key Laboratory of Metal Matrix Composites

Conductive diamond: synthesis, properties, and electrochemical applications - Chemical Society Reviews (RSC Publishing) DOI:10.1039/C7CS00757D

Structural Accelerating Effect of Chloride on Copper Electrodeposition

Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

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Liner sweep voltammetry curve (a) and its partial enlarged drawing (b)

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