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a) Under-bump metallization and micro-bumps fabricated on the VLSI

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PDF) Microring-based multi-chip WDM photonic module

a) Under-bump metallization and micro-bumps fabricated on the VLSI

Metals, Free Full-Text

15544557.ppt

Stacked solder bumping technology for improved solder joint

US6818545B2 - Low fabrication cost, fine pitch and high

Metals, Free Full-Text

Ashok KRISHNAMOORTHY, CEO, PhD

Metals, Free Full-Text

Mehdi ASGHARI KHIAVI, University of Toronto, Toronto

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Figure 3 from Under Bump Metallurgy (UBM)-a technology review for