Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect

Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect

Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect

Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect

Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect

Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect

Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect

The outline of bump bond process steps. (1) deposition of field metal

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Receptor-ligand hydrogen bonds (green colour) and bumps (pink

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